DRV2604L Datasheet, PDF (5/73 Pages) Texas Instruments – DRV2604L 2- to 5.2-V Haptic Driver for LRA and ERM with Internal Memory and Smart-Loop Architecture

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6 Specifications
DRV2604L
SLOS866D – MAY 2014 – REVISED JUNE 2015
6.1 Absolute Maximum Ratings
over operating free-air temperature range, T_A = 25°C (unless otherwise noted)
MIN
V_DD
–0.3
EN
–0.3
Input voltage
SDA
–0.3
SCL
–0.3
IN/TRIG
–0.3
Operating free-air temperature, T_A
–40
Operating junction temperature, T_J
–40
Storage temperature, T_stg
–65
MAX
5.5
V_DD + 0.3
V_DD + 0.3
V_DD + 0.3
V_DD + 0.3
85
150
150
UNIT
V
V
V
V
V
°C
°C
°C
6.2 ESD Ratings
9-PIN DSBGA PACKAGE
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
10-PIN VSSOP PACKAGE
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001
OUT+, OUT– pins⁽³⁾
Other pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins⁽²⁾
VALUE UNIT
±1000
V
±250
±500
±1000 V
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±1000
V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
(3) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_DD
ƒ_(PWM)
Z_L
V_IL
V_IH
V_I(ANA)
ƒ_(LRA)
Supply voltage
PWM input frequency⁽¹⁾
Load impedance⁽¹⁾
Digital low-level input voltage
Digital high-level input voltage
Input voltage (analog mode)
LRA Frequency Range⁽¹⁾
V_DD
IN/TRIG Pin
V_DD = 5.2 V
EN, IN/TRIG, SDA, SCL
EN, IN/TRIG, SDA, SCL
IN/TRIG
(1) Ensured by design. Not production tested.
MIN
MAX UNIT
2
5.2 V
10
250 kHz
8
Ω
0.5 V
1.3
V
0
1.8 V
125
300 Hz
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
φ_JT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
DRV2604L
YZF (DSBGA)
(9-PINS)
145.2
0.9
105
5.1
UNIT
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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