CC3200MOD_15 Datasheet, PDF (55/66 Pages) Texas Instruments – CC3200MOD SimpleLink™ Wi-Fi® and Internet-of-Things Module Solution, a Single-Chip Wireless MCU

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CC3200MOD
SWRS166 – DECEMBER 2014
The recommended values for the PCB are provided for 4- and 2-layer boards in Table 6-2 and Table 6-3,
respectively.
Table 6-2. Recommended PCB Values for 4-Layer Board (L1-L2 = 10 mils)
PARAMETER
W
S
H
Er (FR-4 substrate)
VALUE
20
18
10
4
UNITS
mils
mils
mils
Table 6-3. Recommended PCB Values for 2-Layer Board (L1-L2 = 40 mils)
PARAMETER
W
S
H
Er (FR-4 substrate)
VALUE
35
6
40
3.9
UNITS
mils
mils
mils
6.3.4 General Layout Recommendation
1. Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
2. Do not run signal traces underneath the module on a layer where the module is mounted.
3. RF traces must have 50-Ω impedance
4. RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace
mitered.
5. RF traces must not have sharp corners.
6. There must be no traces or ground under the antenna section.
7. RF traces must have via stitching on the ground plane beside the RF trace on both sides.
8. RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge
of the PCB product in consideration of the product enclosure material and proximity.
Copyright © 2014, Texas Instruments Incorporated
Applications, Implementation, and Layout
55
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