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CC3200MOD_15 Datasheet, PDF (1/66 Pages) Texas Instruments – CC3200MOD SimpleLink™ Wi-Fi® and Internet-of-Things Module Solution, a Single-Chip Wireless MCU
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CC3200MOD
SWRS166 – DECEMBER 2014
CC3200MOD SimpleLink™ Wi-Fi® and Internet-of-Things Module Solution, a Single-Chip
Wireless MCU
1 Module Overview
1.1 Features
1
• The CC3200MOD is a Wi-Fi Module that Consists
of the CC3200R1M2RGC Single-Chip Wireless
MCU. This Fully Integrated Module Includes all
Required Clocks, SPI Flash, and Passives.
• Modular FCC, IC, and CE Certifications Save
Customer Effort, Time, and Money
• Wi-Fi CERTIFIED™ Modules, With Ability to
Request Certificate Transfer for Wi-Fi Alliance
Members
• 1.27-mm Pitch LGA Package for Easy Assembly
and Low-Cost PCB Design
• Applications Microcontroller Subsystem
– ARM Cortex-M4 Core at 80 MHz
– Embedded Memory Options
• Integrated Serial
• RAM (up to 256KB)
• Peripheral Drivers in ROM
– Hardware Crypto Engine for Advanced
Hardware Security Including
• AES, DES, and 3DES
• SHA and MD5
• CRC and Checksum
– 8-Bit, Fast, Parallel Camera Interface
– 1 Multichannel Audio Serial Port (McASP)
Interface With Support for I2S Format
– 1 SD (MMC) Interface
– 32-Channel Micro Direct Memory Access
(μDMA)
– 2 Universal Asynchronous
Receivers/Transmitters (UARTs)
– 2 Serial Peripheral Interfaces (SPIs)
– 1 Inter-integrated Circuit (I2C)
– 4 General-Purpose Timers (GPTs)
– 16-Bit Pulse-Width Modulation (PWM) Mode
– 1 Watchdog Timer Module
– 4-Channel 12-Bit Analog-to-Digital Converters
(ADCs)
– Up to 25 Individually Programmable GPIO Pins
• Wi-Fi Network Processor Subsystem
– 802.11b/g/n Radio, Baseband, and Medium
Access Control
– TCP/IP Stack
• 8 Simultaneous TCP, UDP, or RAW Sockets
• 2 Simultaneous TLS v1.2 or SSL 3.0
Sockets
– Powerful Crypto Engine for Fast, Secured
WLAN Connections With 256-Bit Encryption
– Station, Access Point, and Wi-Fi Direct™ Modes
– WPA2 Personal and Enterprise Security
– SimpleLink Connection Manager for Managing
Wi-Fi Security States
– TX Power
• 17 dBm at 1 DSSS
• 17.25 dBm at 11 CCK
• 13.5 dBm at 54 OFDM
– RX Sensitivity
• –94.7 dBm at 1 DSSS
• –87 dBm at 11 CCK
• –73 dBm at 54 OFDM
– Application Throughput
• UDP: 16 Mbps
• TCP: 13 Mbps
• Power-Management Subsystem
– Integrated DC-DC Converter With a Wide-
Supply Voltage:
• VBAT: 2.3 to 3.6 V
– Low-Power Consumption at 3.6 V
• Hibernate With Real-Time Clock (RTC):
7 μA
• Low-Power Deep Sleep: <275 μA
• RX Traffic: 59 mA at 54 OFDM
• TX Traffic: 229 mA at 54 OFDM
– Additional Integrated Components
• 40.0-MHz Crystal
• 32.768-kHz Crystal (RTC)
• 8-Mbit SPI Serial Flash RF Filter and
Passive Components
– Package and Operating Conditions
• 1.27-mm Pitch, 63-Pin, 20.5-mm ×
17.5 mm LGA Package for Easy Assembly
and Low-Cost PCB Design
• Operating Temperature Range: –20°C to
70°C
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.