CC3200MOD_15 Datasheet, PDF (5/66 Pages) Texas Instruments – CC3200MOD SimpleLink™ Wi-Fi® and Internet-of-Things Module Solution, a Single-Chip Wireless MCU

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CC3200MOD
SWRS166 – DECEMBER 2014
Table of Contents
1 Module Overview ........................................ 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
2 Revision History ......................................... 6
3 Terminal Configuration and Functions.............. 7
3.1 CC3200MOD Pin Diagram ........................... 7
3.2 Pin Attributes ......................................... 8
3.3 Pin Attributes and Pin Multiplexing.................. 10
3.4 Recommended Pin Multiplexing Configurations .... 19
3.5 Drive Strength and Reset States for Analog-Digital
Multiplexed Pins..................................... 22
3.6 Pad State After Application of Power To Chip But
Prior To Reset Release ............................. 22
4 Specifications ........................................... 23
4.1 Absolute Maximum Ratings ......................... 23
4.2 Handling Ratings .................................... 23
4.3 Power-On Hours .................................... 23
4.4 Recommended Operating Conditions............... 23
4.5 Brown-Out and Black-Out ........................... 24
4.6 Electrical Characteristics (3.3 V, 25°C) ............. 25
4.7 Thermal Resistance Characteristics for MOB
Package ............................................. 26
4.8 Reset Requirement ................................. 26
4.9 Current Consumption ............................... 27
4.10 WLAN RF Characteristics ........................... 30
4.11 Timing Characteristics............................... 31
5 Detailed Description ................................... 42
5.1 Overview ............................................ 42
5.2 Functional Block Diagram........................... 42
5.3 ARM Cortex-M4 Processor Core Subsystem ....... 42
5.4 CC3200 Device Encryption ......................... 43
5.5 Wi-Fi Network Processor Subsystem ............... 44
5.6 Power-Management Subsystem .................... 45
5.7 Low-Power Operating Mode ........................ 45
5.8 Memory.............................................. 46
5.9 Boot Modes.......................................... 48
6 Applications, Implementation, and Layout ....... 51
6.1 Reference Schematics .............................. 51
6.2 Bill of Materials...................................... 52
6.3 Layout Recommendations .......................... 52
7 Environmental Requirements and
Specifications ........................................... 56
7.1 Temperature......................................... 56
7.2 Handling Environment .............................. 56
7.3 Storage Condition ................................... 56
7.4 Baking Conditions................................... 56
7.5 Soldering and Reflow Condition .................... 56
8 Product and Documentation Support .............. 58
8.1 Development Support ............................... 58
8.2 Device Nomenclature ............................... 58
8.3 Community Resources .............................. 59
8.4 Trademarks.......................................... 59
8.5 Electrostatic Discharge Caution..................... 59
8.6 Export Control Notice ............................... 59
8.7 Glossary ............................................. 59
9 Mechanical Packaging and Orderable
Information .............................................. 60
9.1 Mechanical Drawing................................. 60
9.2 Package Option ..................................... 61
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