SLDS145B Datasheet, PDF (23/29 Pages) Texas Instruments – TFP410 TI PanelBus DIGITAL TRANSMITTER

TFP410
TI PanelBus™ DIGITAL TRANSMITTER
I²C interface (continued)
S Slave Address W A Sub-Address A Sr Slave Address
Where:
From Master
From Slave
A Acknowledge
S Start condition
/A Not acknowledge (SDA high) P Stop Condition
R Read Condition = 1
Sr Restart Condition
W Write Condition = 0
Figure 13. I²C Read Cycle
SLDS145B − OCTOBER 2001 − REVISED MAY 2011
R A Data A Data /A P
TI PowerPAD 64-pin TQFP package
The TFP410 is available in TI’s thermally enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10mm × 10mm × 1,0 mm TQFP outline with 0,5 mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 64-pin TQFP PowerPAD package offers a backside solder plane that connects directly to the die mount
pad for enhanced thermal conduction. For thermal considerations, soldering the backside of the TFP410 to the
application board is not required since the device power dissipation is well within the package capability when
not soldered.
Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.
Because the die pad is electrically connected to the chip substrate and hence chip ground, connecting the back
side of the PowerPAD package to a PCG ground plane provides a low-inductance, low-impedance connection
to help improve EMI, ground bounce, and power supply noise performance.
Table 2 contains the thermal properties of the TI 64-pin TQFP PowerPAD package. The 64-pin TQFP
non-PowerPAD package is included only for reference.
Table 2. TI 64-Pin TQFP (10 × 10 × 1,0 mm)/0,5 mm Lead-Pitch
PARAMETER
WITHOUT
PowerPAD™
PowerPAD™
NOT CONNECTED TO
PCB THERMAL PLANE
PowerPAD™
CONNECTED TO PCB
THERMAL PLANE
(see Note 13)
R_θJA
Thermal resistance, junction-to-ambient
(see Notes 13 and 14)
75.83°C/W
42.20°C/W
21.47°C/W
R_θJC
P_D
Thermal resistance, junction-to-case (see Notes 13 and 14)
Power handling capabilities of package (see Notes 13, 14,
and 15)
7.80°/W
0.92 W
0.38°C/W
1.66 W
0.38°C/W
3.26 W
NOTES: 13. Specified with the PowerPAD bond pad on the backside of the package soldered to a 2-oz. Cu plate PCB thermal plane.
14. Airflow is at 0 LFM (no airflow)
15. Specified at 150°C junction temperature and 80°C ambient temperature.
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