LSM6DS3H Datasheet, PDF (99/104 Pages) STMicroelectronics – always-on 3D accelerometer and 3D gyroscope

LSM6DS3H
12 Soldering information
Soldering information
The LGA package is compliant with the ECOPACK^®, RoHS and "Green" standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020.
Leave "Pin 1 Indicator" unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
DocID028370 Rev 4
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