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| LSM330 Datasheet, PDF (31/75 Pages) STMicroelectronics – Power-down and sleep modes | |||
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LSM330
Application hints
The functionality of the device and the measured acceleration/angular rate data is
selectable and accessible through the SPI/I2C interface.
The functions, the threshold and the timing of the two interrupt pins for each sensor can be
completely programmed by the user through the SPI/I2C interface.
5.2
Soldering information
The LGA package is compliant with ECOPACK®, RoHS and âGreenâ standards. It is
qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave âPin 1 Indicatorâ unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
DocID023426 Rev 3
31/75
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