LSM330 Datasheet, PDF (30/75 Pages) STMicroelectronics – Power-down and sleep modes

Application hints
5
Application hints
Figure 14. LSM330 electrical connections
Vdd
Vdd_IO
C2
100 nF
GND
C3
C4
100 nF
GND
10 μF
GND
*C1
10nF(25V)
GND
1
SCL_A/G
VDD_IO
SDA/SDI_A/G
SDO_G
6
(TOP VIEW)
18
RES
RES
RES
RES
13
LSM330
I2C configuration
Vdd_IO
Rpu
Rpu= 10kOhm
SCL
SDA
Pull-up to be added
GND
* C1 must guarantee 1 nF value under
11 V bias condition
AM14726V1
5.1
External capacitors
The device core is supplied through the Vdd line. Power supply decoupling capacitors (C2,
C3=100 nF ceramic, C4=10 μF Al) should be placed as near as possible to the supply pin of
the device (common design practice).
All voltage and ground supplies must be present at the same time to achieve proper
behavior of the IC (refer to Figure 14).
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