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M36DR432A Datasheet, PDF (25/46 Pages) STMicroelectronics – 32 Mbit 2Mb x16, Dual Bank, Page Flash Memory and 4 Mbit 256K x16 SRAM, Multiple Memory Product
M36DR432A, M36DR432B
Symbol Parameter
Device
Test Condition
Min Typ Max Unit
VPPL
Program Voltage
(Program or
Erase operations)
Flash
1.65
3.6
V
VPPH
Program Voltage
(Program or
Erase operations)
Flash
11.4
12.6
V
Program Voltage
VPPLK (Program and
Erase lock-out)
Flash
1
V
VLKO
VDDF Supply
Voltage (Program
and Erase lock-
out)
Flash
2
V
Note: 1. IDDES and IDDWS are specified with device deselected. If device is read while in erase suspend, current draw is sum of IDDES
and IDDR. If the device is read while in program suspend, current draw is the sum of IDDWS and IDDR.
Table 25. Flash Read AC Characteristics
(TA = –40 to 85°C; VDDF = 1.65V to 2.2V)
Flash
Symbol Alt
Parameter
Test Condition
100
120
Min Max Min Max
tAVAV
tRC
Address Valid to Next Address
Valid
EF = VIL, GF = VIL 100
120
tAVQV
tACC
Address Valid to Output Valid
(Random)
EF = VIL, GF = VIL
100
120
tAVQV1
tPAGE
Address Valid to Output Valid
(Page)
EF = VIL, GF = VIL
35
45
tAXQX
tOH
Address Transition to Output
Transition
EF = VIL, GF = VIL
0
0
tEHQX
tOH
Chip Enable High to Output
Transition
GF = VIL
0
0
tEHQZ (1)
tHZ Chip Enable High to Output Hi-Z
GF = VIL
25
35
tELQV (2)
tCE Chip Enable Low to Output Valid
GF = VIL
100
120
tELQX (1)
tLZ
Chip Enable Low to Output
Transition
GF = VIL
0
0
tGHQX
tOH
Output Enable High to Output
Transition
EF = VIL
0
0
tGHQZ (1)
tDF
Output Enable High to Output
Hi-Z
EF = VIL
25
35
tGLQV (2)
tOE
Output Enable Low to Output
Valid
EF = VIL
25
35
tGLQX (1)
tOLZ
Output Enable Low to Output
Transition
EF = VIL
0
0
Note: 1. Sampled only, not 100% tested.
2. GF may be delayed by up to tELQV - tGLQV after the falling edge of EF without increasing tELQV
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
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