RX110_16 Datasheet, PDF (68/108 Pages) Renesas Technology Corp – 32 MHz 32-bit RX MCUs, 50 DMIPS

RX110 Group
5. Electrical Characteristics
5.3.3
Timing of Recovery from Low Power Consumption Modes
Table 5.24 Timing of Recovery from Low Power Consumption Modes (1)
Conditions: 1.8 V ≤ VCC ≤ 3.6 V, 1.8 V ≤ AVCC0 ≤ 3.6 V, VSS = AVSS0 = 0 V, T_a = –40 to +105°C
Item
Symbol Min. Typ. Max. Unit
Test
Conditions
Recovery time
from software
standby mode*¹
High-speed
mode
Crystal
connected to
main clock
oscillator
Main clock oscillator
operating*²
External clock
input to main
clock oscillator
Main clock oscillator
operating*³
Sub-clock oscillator operating
HOCO clock oscillator operating*⁴
LOCO clock oscillator operating
t_SBYMC
—
2
3 ms Figure 5.28
t_SBYEX
—
35
50
μs
t_SBYSC
—
650 800
μs
t_SBYHO
—
40
55
μs
t_SBYLO
—
40
55
μs
Note: When the division ratios of PCLKB, PCLKD, FCLK, and ICLK are all set to 1.
Note 1. The recovery time varies depending on the state of each oscillator when the WAIT instruction is executed. The recovery time
when multiple oscillators are operating varies depending on the operating state of the oscillators that are not selected as the
system clock source. This applies when only the oscillator listed in each item is operating and the other oscillators are stopped.
Note 2. When the frequency of the crystal is 20 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
Note 3. When the frequency of the external clock is 20 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
Note 4. When the frequency of HOCO is 32 MHz.
When the high-speed clock oscillator wait control register (HOCOWTCR) is set to 05h.
Table 5.25 Timing of Recovery from Low Power Consumption Modes (2)
Conditions: 1.8 V ≤ VCC ≤ 3.6 V, 1.8 V ≤ AVCC0 ≤ 3.6 V, VSS = AVSS0 = 0 V, T_a = –40 to +105°C
Item
Symbol Min. Typ. Max. Unit
Test
Conditions
Recovery time
from software
standby mode*¹
Middle-speed
mode
Crystal
connected to
main clock
oscillator
Main clock oscillator
operating*²
External clock
input to main
clock oscillator
Main clock oscillator
operating*³
Sub-clock oscillator operating
HOCO clock oscillator operating*⁴
LOCO clock oscillator operating
t_SBYMC
—
2
3 ms Figure 5.28
t_SBYEX
—
3
4
μs
t_SBYSC
—
600 750
μs
t_SBYHO
—
40
50
μs
t_SBYLO
—
4.8
7
μs
Note: When the division ratios of PCLKB, PCLKD, FCLK, and ICLK are all set to 1.
Note 1. The recovery time varies depending on the state of each oscillator when the WAIT instruction is executed. The recovery time
when multiple oscillators are operating varies depending on the operating state of the oscillators that are not selected as the
system clock source. This applies when only the oscillator listed in each item is operating and the other oscillators are stopped.
Note 2. When the frequency of the crystal is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
Note 3. When the frequency of the external clock is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
Note 4. When the frequency of HOCO is 8 MHz.
When the high-speed clock oscillator wait control register (HOCOWTCR) is set to 05h.
R01DS0202EJ0120 Rev.1.20
Jul 29, 2016
Page 68 of 108