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HYB18T512161BF Datasheet, PDF (3/41 Pages) Qimonda AG – 512-Mbit x16 DDR2 SDRAM | |||
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Internet Data Sheet
1
Overview
HYB18T512161BFâ20/22/25/28/33
512-Mbit Double-Data-Rate-Two SDRAM
This chapter gives an overview of the 512-Mbit Double-Data-Rate-Two SDRAM product family for graphics application and
describes its main characteristics.
1.1
Features
The 512-Mbit Double-Data-Rate-Two SDRAM offers the following key features:
⢠1.8 V ± 0.1V VDD for [â25/â28/â33]
⢠2.0 V ± 0.1V VDD for [â20/â22]
⢠1.8 V ± 0.1V VDDQ for [â25/â28/â33]
⢠2.0 V ± 0.1V VDDQ for [â20/â22]
⢠DRAM organizations with 16 data in/outputs
⢠Double Data Rate architecture:
â two data transfers per clock cycle
â four internal banks for concurrent operation
⢠Programmable CAS Latency: 3, 4, 5, 6, 7
⢠Programmable Burst Length: 4 and 8
⢠Differential clock inputs (CK and CK)
⢠Bi-directional, differential data strobes (DQS and DQS) are
transmitted / received with data. Edge aligned with read
data and center-aligned with write data.
⢠DLL aligns DQ and DQS transitions with clock
⢠DQS can be disabled for single-ended data strobe
operation
⢠Commands entered on each positive clock edge, data and
data mask are referenced to both edges of DQS
⢠Data masks (DM) for write data
⢠Posted CAS by programmable additive latency for better
command and data bus efficiency
⢠Off-Chip-Driver impedance adjustment (OCD) and On-
Die-Termination (ODT) for better signal quality.
⢠Auto-Precharge operation for read and write bursts
⢠Auto-Refresh, Self-Refresh and power saving Power-
Down modes
⢠Average Refresh Period 7.8 µs at a TCASE lower than
85 °C, 3.9 µs between 85 °C and 95 °C
⢠Full Strength and reduced Strength (60%) Data-Output
Drivers
⢠2kB page size
⢠Packages: P-TFBGA-84 for Ã16 components
⢠RoHS Compliant Products1)
Product Number
HYB18T512161BFâ20/22/25/28/33
TABLE 1
Ordering Information for RoHS compliant products
Org.
Clock (MHz)
Package
à 16
500/450/400/350/300
P-TFBGA-84
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.43, 2006-11
3
03292006-L40N-L04G
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