UPD98405 Datasheet, PDF (61/64 Pages) NEC – 155M ATM INTEGRATED SAR CONTROLLER

µPD98405
4. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface-mount type
• µPD98405GL-PMU: 304-pin plastic QFP (0.5-mm fine pitch) (40 × 40 mm)
Soldering Method(s)
Soldering Conditions
Infrared reflow
Partial pin heating
Package peak temperature: 235°C, Time: 30 sec max. (210°C min.),
Number of times: once, Number of days: 3^Note (after that, prebaking is
necessary at 125°C for 20 hours)
Pin temperature: 300°C max., Time: 3 sec. Max. (per device side)
Recommended
Conditions Symbol
IR35-203-1
–
Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25°C, 65%
RH MAX.
Data Sheet S12689EJ2V0DS00
61