PIC32MX795F512L-80IPT Datasheet, PDF (60/68 Pages) Microchip Technology – PIC32 Flash Programming Specification

PIC32
20.0 AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
TABLE 20-1: AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
Standard Operating Conditions
Operating Temperature: 0ºC to +70ºC. Programming at +25ºC is recommended.
Param.
No.
Symbol
Characteristic
Min. Max. Units Conditions
D111
D113
D114
D031
D041
D080
D090
D012
D013
P1
P1A
P1B
VDD
IDDP
IPEAK
VIL
VIH
VOL
VOH
CIO
CF
TPGC
TPGCL
TPGCH
Supply Voltage During Programming
Supply Current During Programming
Instantaneous Peak Current During Start-up
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O pin (PGEDx)
Filter Capacitor Value on VCAP
Serial Clock (PGECx) Period
Serial Clock (PGECx) Low Time
Serial Clock (PGECx) High Time
—
—
V See Note 1
—
—
mA See Note 1
—
—
mA See Note 1
—
—
V See Note 1
—
—
V See Note 1
—
—
V See Note 1
—
—
V See Note 1
—
—
pF See Note 1
—
—
F See Note 1
100
—
ns
—
40
—
ns
—
40
—
ns
—
P6
TSET2 VDD Setup Time to MCLR 
100
—
ns
—
P7
THLD2 Input Data Hold Time from MCLR 
P9A TDLY4 PE Command Processing Time
P9B TDLY5 Delay between PGEDx by the PE to PGEDx
Released by the PE
P11 TDLY7 Chip Erase Time
P12 TDLY8 Page Erase Time
P13 TDLY9 Row Programming Time
500
—
ns
—
40
—
s
—
15
—
s
—
—
—
ms See Note 1
—
—
ms See Note 1
—
—
ms See Note 1
P14 TR
MCLR Rise Time to Enter ICSP™ mode
P15 TVALID Data Out Valid from PGECx 
—
1.0
s
—
10
—
ns
—
P16 TDLY8 Delay between Last PGECx  and MCLR 
0
—
s
—
P17 THLD3 MCLR to VDD 
—
100
ns
—
P18 TKEY1 Delay from First MCLR to First PGECx for Key 40
—
ns
—
Sequence on PGEDx
P19 TKEY2 Delay from Last PGECx for Key Sequence on
40
—
ns
—
PGEDx to Second MCLR 
P20 TMCLRH MCLR High Time
—
500
µs
—
Note 1: Refer to the “Electrical Characteristics” chapter in the specific device data sheet for the Minimum and
Maximum values for this parameter.
DS61145L-page 60
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