PIC24HJ32GP302_11 Datasheet, PDF (341/368 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers

PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
30.0 PACKAGING INFORMATION
28-Lead SPDIP
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC24HJ32GP
302-E/SP e3
0730235
28-Lead SOIC (.300”)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
PIC24HJ32GP
302-E/SO e3
0730235
28-Lead QFN-S
Example
XXXXXXXX
XXXXXXXX
YYWWNNN
44-Lead QFN
24HJ32GP
302EMM
0730235
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
44-Lead TQFP
PIC
24HJ32GP304
-E/ML ^e3
0730235
Example
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIC
24HJ32GP304
-I/PT e3
0730235
Legend:
XX...X
Y
YY
WW
NNN
e3
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( _e3 )
can be found on the outer packaging for this package.
Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next
line, thus limiting the number of available characters for customer-specific information.
© 2011 Microchip Technology Inc.
DS70293E-page 341