PIC24HJ32GP302_11 Datasheet, PDF (282/368 Pages) Microchip Technology – High-Performance, 16-bit Microcontrollers

PIC24HJ32GP302/304, PIC24HJ64GPX02/X04 AND PIC24HJ128GPX02/X04
28.1 DC Characteristics
TABLE 28-1: OPERATING MIPS VS. VOLTAGE
Characteristic
VDD Range
(in Volts)
Temp Range
(in °C)
3.0-3.6V
3.0-3.6V
-40°C to +85°C
-40°C to +125°C
Max MIPS
PIC24HJ32GP302/304,
PIC24HJ64GPX02/X04 and
PIC24HJ128GPX02/X04
40
40
TABLE 28-2: THERMAL OPERATING CONDITIONS
Rating
Industrial Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Extended Temperature Devices
Operating Junction Temperature Range
Operating Ambient Temperature Range
Power Dissipation:
Internal chip power dissipation:
PINT = VDD x (IDD – Σ IOH)
I/O Pin Power Dissipation:
I/O = Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)
Maximum Allowed Power Dissipation
Symbol Min
Typ
Max Unit
TJ
-40
—
+125
°C
TA
-40
—
+85
°C
TJ
-40
—
+155
°C
TA
-40
—
+125
°C
PD
PINT + PI/O
W
PDMAX
(TJ – TA)/θJA
W
TABLE 28-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic
Symbol Typ Max Unit Notes
Package Thermal Resistance, 44-pin QFN
θJA
30
—
°C/W
1
Package Thermal Resistance, 44-pin TFQP
θJA
40
—
°C/W
1
Package Thermal Resistance, 28-pin SPDIP
θJA
45
—
°C/W
1
Package Thermal Resistance, 28-pin SOIC
θJA
50
—
°C/W
1
Package Thermal Resistance, 28-pin QFN-S
θJA
30
—
°C/W
1
Note 1: Junction to ambient thermal resistance, Theta-JA (θJA) numbers are achieved by package simulations.
DS70293E-page 282
© 2011 Microchip Technology Inc.