MAX1441 Datasheet, PDF (40/41 Pages) Maxim Integrated Products – Automotive, Two-Channel Proximity and Touch Sensor

Automotive, Two-Channel Proximity and
Touch Sensor
Applications Information
Layout, Grounding, and Bypassing
For best performance, use PCBs. Ensure to separate
digital and analog signal lines from each other. Do not
run analog and digital signals parallel to one another
(especially clock signals) or do not run digital lines
underneath the IC package. High-frequency noise in
the power-supply lines can affect performance. Bypass
the VAA and VDD supplies with 0.47FF capacitors close
to VAA and VDD. Bypass the VBATT supply with a 0.1FF
capacitor close to the VDD pin. Minimize capacitor lead
lengths for best supply-noise rejection. Refer to the
MAX1441 Evaluation Kit for an example of proper layout.
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
20 TSSOP
PACKAGE
CODE
U20M+2
OUTLINE
No.
21-0066
LAND
PATTERN No.
90-0116
40