MAX1441 Datasheet, PDF (2/41 Pages) Maxim Integrated Products – Automotive, Two-Channel Proximity and Touch Sensor

Automotive, Two-Channel Proximity and
Touch Sensor
ABSOLUTE MAXIMUM RATINGS
(VDD = VAA, AGND = DGND, unless otherwise noted.)
V_BATT to AGND......................................................-0.3V to +45V
V_AA, V_DD to AGND..................................................-0.3V to +4V
SINPUT1, SINPUT2, AGUD1,
AGUD2 to AGND....................................-0.3V to (V_AA + 0.3V)
RESET, P0._, I.C. to DGND....................... -0.3V to (V_DD + 0.3V)
AGND to DGND....................................................-0.3V to +0.3V
OUT1, OUT2, to AGND..........................................-0.3V to +28V
OUT_, P0._, Continuous Output Current........................P 20mA
Continuous Power Dissipation (T_A = +70NC)
Single-Layer PCB
20-Lead TSSOP (derate 11mW/NC above +70NC).......879mW
Multilayer PCB
20-Lead TSSOP (derate 13.6mW/NC above +70NC)..1084mW
Junction-to-Case Thermal Resistance (B_JC) (Note 1)
20-Lead TSSOP......................................................... +20NC/W
Junction-to-Ambient Thermal Resistance (B_JA) (Note 1)
Single-Layer PCB
20-Lead TSSOP......................................................... +91NC/W
Multilayer PCB
20-Lead TSSOP...................................................... +73.8NC/W
Operating Temperature Range......................... -40NC to +105NC
Junction Temperature......................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s).................................+300NC
Soldering Temperature (reflow).......................................+260NC
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to _{www.maxim-ic.com/thermal-tutorial}.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VBATT = 5V to 28V, VAA = VDD, TA = -40NC to +105NC. Typical values are at VBATT = 14V, fEX = 300kHz, TA = +25NC, unless oth-
erwise noted.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
Average Power-Supply Current
16ms capacitance-to-digital (C2D) con-
version time, two active channels; CPU in
sleep mode
100 120
FA
CAPACITANCE-TO-DIGITAL CONVERTER
Bit Resolution
12
Bits
CRNG_[1:0] = 10
20
Input Capacitance Range
CRNG_[1:0] = 01
10
pF
CRNG_[1:0] = 00
5
Input Capacitance LSB
Resolution
20pF capacitance range
10pF capacitance range
5pF capacitance range
4.8
2.4
fF
1.2
Integral Nonlinearity
INL
1
%FS
Differential Nonlinearity
DNL
0.5
LSB
Sampling Time
fEX = 300kHz (Note 3)
584 600 624
Fs
Number of Effective Bits
11
Bits
DC Input Current of SIN1, SIN2
300
nA
INPUT CAPACITANCE EXCITATION SOURCE
Source Peak-to-Peak Voltage
300kHz excitation frequency
0.96
1.0
1.21
VP-P
Minimum Excitation Frequency
fEXMIN Frequency Control register = 0x0A (Note 3)
100
kHz
Maximum Excitation Frequency
fEXMAX Frequency Control register = 0x32 (Note 3)
500
kHz
2