English
Language : 

5968-4632E Datasheet, PDF (29/77 Pages) Keysight Technologies – Probing Solutions for Logic Analyzers
29 | Keysight | Probing Solutions for Logic Analyzers - Data Sheet
Probing Solutions for 90-pin Logic Analyzers
Soft Touch Connectorless Probing (Continued)
Probe footprint dimensions
Use these probe footprint dimensions for the PC board pads and holes for attaching the
retention module.
Soft touch
1.99 mm
2.03 mm
3.49 mm
29.97 mm
1.00 mm typ
B
0.81 0.03 mm
(keying/alignment hole)
R 0.29 mm
.15 B
34.04 mm
26.00 mm
C
0.79 0.08 mm pth
.15 B
2.53 mm
B1
B27
A1
A27
1.27 mm
2.41 mm
0.71 mm
pad height 54x
12
Notes:
footprint keep
out boundary
0.58 mm
pad width 54x
12
A
1.35 mm
6.99 mm
retention hole pads
both sides
3.25 mm
1.83 mm
0.79 0.08 mm
pth 4x
1. Must maintain a solder mask web between pads when traces are 4. Footprint is compatible with retention module,
routed between the pads on the same layer. Soldermask may not
Keysight part # E5387-68702.
encroach onto the pads within the pad dimension shown.
Half-size soft touch
5. Retention module dimensions are 34.04 mm x 7.01 mm x 4.98 mm
2. Via in pad not allowed on these pads. Via edges may be tangent 34.04 mmtall relative to the top surface of the PDB. Retention pins extend
to pad edges as long as a solder mask web between vias and pads
4.32 mm beyond the bottom surface of the RM through the PCB.
is maintained.
29.97 mm
26.006.mmAssume normal artwork tolerances for pad size dimensions.
3. Permissible surface finishes on pads are HASL, immersion silver,
or gold over nickel.
1.00 mm typ
1.99 mm
B
2.03 mm
3.49 mm
0.81 0.03 mm
(keying/alignment hole)
R 0.29 mm
.15 B
C
0.79 0.08 mm pth
.15 B
2.53 mm
B1
B27
A1
A27
1.27 mm
2.41 mm
0.71 mm
pad height 54x
12
footprint keep
out boundary
0.58 mm
pad width 54x
12
Notes:
1. Must maintain a solder mask web between pads when traces are
routed between the pads on the same layer. Soldermask may not
encroach onto the pads within the pad dimension shown.
2. Via in pad not allowed on these pads. Via edges may be tangent
to pad edges as long as a solder mask web between vias and pads
is maintained.
3. Permissible surface finishes on pads are HASL, immersion silver,
or gold over nickel.
A
1.35 mm
6.99 mm
retention hole pads
both sides
3.25 mm
1.83 mm
0.79 0.08 mm
pth 4x
4. Footprint is compatible with retention module,
Keysight part # E5387-68702.
5. Retention module dimensions are 34.04 mm x 7.01 mm x 4.98 mm
tall relative to the top surface of the PDB. Retention pins extend
4.32 mm beyond the bottom surface of the RM through the PCB.
6. Assume normal artwork tolerances for pad size dimensions.
Figure 4.22. Footprint dimensions.