BX80547PG3200FSL8Q6 Datasheet, PDF (99/105 Pages) Intel Corporation – Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition

Balanced Technology Extended (BTX) Type I Boxed Processor Specifications
8 Balanced Technology Extended
(BTX) Type I Boxed Processor
Specifications
The Pentium 4 processor in the 775-land package will also be offered as an boxed Intel processor.
Boxed Intel processors are intended for system integrators who build systems from largely standard
components. The boxed Pentium 4 processor in the 775-land package will be supplied with a
cooling solution known as the Thermal Module Assembly (TMA). Figure 8-1 shows a mechanical
representation of a boxed Pentium 4 processor in the 775-land package. This chapter documents
mainboard and system requirements for the TMA that will be supplied with the boxed Pentium 4
processor in the 775-land package. This chapter is particularly important for OEMs that
manufacture mainboards for system integrators.
Note: Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in
brackets].
Note:
Drawings in this section reflect only the specifications on the boxed Intel processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer’s responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platforms and chassis. Refer to the Intel^® Pentium^® 4
Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guidelines for further
guidance.
Figure 8-1. Mechanical Representation of the Boxed Processor
NOTE: The duct, clip, heatsink, and fan can differ from this drawing representation; however, the basic shape
and size will remain the same.
Datasheet
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