BX80547PG3200FSL8Q6 Datasheet, PDF (13/105 Pages) Intel Corporation – Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition

Introduction
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Pentium 4 processor Extreme Edition on 90 nm process in the 775-land package—
Processor in the FC-LGA4 package with a 2-MB L2 cache.
• Pentium 4 processor 6xx sequence on 90 nm process in the 775-land package— Processor
in the FC-LGA4 package with a 2-MB L2 cache.
• Processor — For this document, the term processor refers to the Pentium 4 processor 6xx
sequence on 90 nm process in the 775-land package and the Pentium 4 processor Extreme
Edition on 90 nm process in the 775-land package.
• Keep-out zone — The area on or near the processor that system design can not use.
• Intel^® 925X/925XE Express chipset — Chipsets that supports DDR2 memory technology for
the Pentium 4 processor in the 775-land package.
• Intel^® 915G/915GV/915GL and 915P/915PL Express chipset — Chipsets that supports
DDR/DDR2 memory technology for the Pentium 4 processor in the 775-land package.
• Intel^® 945G/945P Express chipset — Chipsets that supports DDR2 memory technology for
the Pentium 4 processor in the 775-land package.
• Intel^® 955X Express chipset — Chipsets that supports DDR2 memory technology for the
Pentium 4 processor in the 775-land package.
• Processor core — Processor core die with integrated L2 cache.
• FC-LGA4 package — The Pentium 4 processor is available in a Flip-Chip Land Grid Array 4
package, consisting of a processor core mounted on a substrate with an integrated heat
spreader (IHS).
• LGA775 socket — The Pentium 4 processor mates with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
• Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
• Storage conditions—Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation—Refers to normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.
Datasheet
13