BX80547PG3200FSL8Q6 Datasheet, PDF (76/105 Pages) Intel Corporation – Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition

Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature
must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Processor
Name/Number
Core Frequency
(GHz)
Thermal
Design Power
(W)
Minimum T_C
(°C)
Maximum T_C (°C)
Notes
Extreme Edition
3.73 (PRB = 1)
115
670/672
3.80 (PRB = 1)
115
660/662
3.60 (PRB = 1)
115
650
3.40 (PRB = 0)
84
640
3.20 (PRB = 0)
84
630
3 (PRB = 0)
84
5
See Table 5-2 and Figure 5-1
1, 2
5
See Table 5-2 and Figure 5-1
1, 2
5
See Table 5-2 and Figure 5-1
1, 2
5
See Table 5-3 and Figure 5-2
1, 2
5
See Table 5-3 and Figure 5-2
1, 2
5
See Table 5-3 and Figure 5-2
1, 2
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the
processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum
T_C will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed com-
binations of power and T_C.
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Datasheet