BX80547PG3200FSL8Q6 Datasheet, PDF (26/105 Pages) Intel Corporation – Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition

Electrical Specifications
Table 2-8. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit Notes¹
I_TT
FSB termination current
—
—
3.5
A
13, 17
I_{CC_VCCA}
I_CC for PLL lands
—
—
120
mA
13
I_{CC_VCCIOPLL} I_CC for I/O PLL land
—
—
100
mA
13
I_{CC_GTLREF}
I_CC for GTLREF
—
—
200
μA
13
NOTES:
1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These specifications will be up-
dated with characterized data from silicon measurements at a later date.
2. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can not be altered. Indi-
vidual maximum VID values are calibrated during manufacturing such that two processors at the same frequency may have different settings within
the VID range. Note that this differs from the VID employed by the processor during a power management event (Thermal Monitor 2, Enhanced
Intel SpeedStep Technology, or Enhanced Halt State).
3. These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is required. See Section 2.4
and Table 2-2 for more information.
4. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz bandwidth os-
cilloscope, 1.5 pF maximum probe capacitance, and 1 MΩ minimum impedance. The maximum length of ground wire on the probe should be less
than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.
5. Refer to Table 2-10 and Figure 2-3 for the minimum, typical, and maximum V_CC allowed for a given current. The processor should not be subjected
to any V_CC and I_CC combination wherein V_CC exceeds V_{cc_max} for a given current.
6. 775_VR_CONFIG_04A and 775_VR_CONFIG_04B refers to voltage regulator configurations that are defined in the Voltage Regulator Down
(VRD) 10.1 Design Guide for Desktop LGA775 Socket.
7. Adherence to this loadline specification for the processor is required to ensure reliable processor operation.
8. Refer to Table 2-9 and Figure 2-2 for the minimum, typical, and maximum V_CC allowed for a given current. The processor should not be subjected
to any V_CC and I_CC combination wherein V_CC exceeds V_{CC_max} for a given current.
9. These frequencies will operate in a system designed for 775_VR_CONFIG_04B processors. The power and I_CC will be incrementally higher in
this configuration due to the improved loadline and resulting higher V_CC.
10. I_{cc_max} is specified at V_{CC_max}.
11. The current specified is also for AutoHALT State.
12. I_CC Stop-Grant and I_CC Auto Halt are specified at V_{CC_max}.
13. These parameters are based on design characterization and are not tested.
14. The maximum instantaneous current the processor will draw while the thermal control circuit is active as indicated by the assertion of PROCHOT#
is the same as the maximum I_CC for the processor.
15. V_TT must be provided via a separate voltage source and not be connected to V_CC. This specification is measured at the land.
16. Baseboard bandwidth is limited to 20 MHz.
17. This is maximum total current drawn from V_TT plane by only the processor. This specification does not include the current coming from RTT
(through the signal line). Refer to the Voltage Regulator Down (VRD) 10.1 Design Guide for Desktop LGA775 Socket to determine the total I_TT
drawn by the system. Contact your Intel representative for further details and documentation.
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Datasheet