BX80547PG3200FSL8Q6 Datasheet, PDF (35/105 Pages) Intel Corporation – Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition

Package Mechanical Specifications
3 Package Mechanical
Specifications
The Pentium 4 processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a processor core
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions,
such as a heatsink. Figure 3-1 shows a sketch of the processor package components and how they
are assembled together. Refer to the LGA775 Socket Mechanical Design Guide for complete details
on the LGA775 socket.
The package components shown in Figure 3-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 3-1. Processor Package Assembly Sketch
Core (die)
TIM
IHS
Substrate
System Board
Capacitors
LGA775 Socket
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The drawings
include dimensions necessary to design a thermal solution for the processor. These dimensions
include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in].
Note: Guidelines on potential IHS flatness variation with socket load plate actuation and installation of
the cooling solution is available in the processor Thermal/Mechanical Design Guidelines.
Datasheet
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