BX80547PG3200FSL8Q6 Datasheet, PDF (75/105 Pages) Intel Corporation – Intel® Pentium® 4 Processor 6xxΔ Sequence and Intel® Pentium® 4 Processor Extreme Edition

Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
5.1
Processor Thermal Specifications
The Pentium 4 processor requires a thermal solution to maintain temperatures within operating
limits as set forth in Section 5.1.1. Any attempt to operate the processor outside these operating
limits may result in permanent damage to the processor and potentially other components within
the system. As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to reliable,
long-term system operation.
A complete thermal solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the Intel^®
Pentium^® 4 Processor on 90 nm Process in the 775-land LGA Package Thermal Design
Guidelines.
Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on
the boxed processor.
5.1.1
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (T_C) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The Pentium 4 processor introduces a new methodology for managing processor temperatures that
is intended to support acoustic noise reduction through fan speed control. Selection of the
appropriate fan speed is based on the temperature reported by the processor’s Thermal Diode. If the
diode temperature is greater than or equal to T_CONTROL, then the processor case temperature must
remain at or below the temperature as specified by the thermal profile. If the diode temperature is
less than T_CONTROL, then the case temperature is permitted to exceed the thermal profile, but the
diode temperature must remain at or below T_CONTROL. Systems that implement fan speed control
must be designed to take these conditions into account. Systems that do not alter the fan speed only
need to guarantee the case temperature meets the thermal profile specifications.
To determine a processor's case temperature specification based on the thermal profile, it is
necessary to accurately measure processor power dissipation.
Datasheet
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