82551IT Datasheet, PDF (96/102 Pages) Intel Corporation – Fast Ethernet PCI Controller

82551IT — Networking Silicon
Figure 29. 196 PBGA Package Pad Detail
Detail Area
0.45
Solder Resist Opening
0.60
Metal Diameter
As illustrated in Figure 29, the 82551IT package uses solder mask defined pads. The copper area is
0.60 mm and the opening in the solder mask is 0.45 mm. The nominal ball sphere diameter is 0.50
mm.
90
Datasheet