80960HA Datasheet, PDF (32/102 Pages) Intel Corporation – 80960HA/HD/HT 32-Bit High-Performance Superscalar Processor

80960HA/HD/HT
3.4
Heat Sink Adhesives
Intel recommends silicone-based adhesives to attach heat sinks to the PGA package. There is no
particular recommendation concerning the PQ4 package.
3.5
PowerQuad4 Plastic Package
The 80960Hx family is available in an improved version of the common 208-lead SQFP plastic
package called the PowerQuad4* (PQ4). The PQ4 package dimensions and lead pitch are identical
to the SQFP package and the former PQ2 package, so the PQ4 fits into the same board footprint.
The advantage of the PQ4 package is the superior thermal conductivity that allows the plastic
version of the 80960Hx to operate with the same 0-85°C temperature specifications as the more
expensive ceramic PGA package.
The PQ4 package integrates a copper heat sink within the package to dissipate heat effectively. See
Table 14 and Table 15.
3.6
Stepping Register Information
The memory-mapped register at FF008710H contains the 80960Hx Device ID. The ID is identical
to the ID obtained from a JTAG Query. Figure 6 defines the current 80960Hx Device IDs. The
value for device identification is compliant with the IEEE 1149.1 specification and Intel standards.
Table 16 describes the fields of the device ID.
Figure 6. 80960Hx Device Identification Register
Part Number
Version V_CC
Product
Type
Gen
Model
Manufacturer ID
1
1 0001 00 0010
28
24
20
16
0 0000 00 10011
12
8
4
0
26
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