80C186EC Datasheet, PDF (25/57 Pages) Intel Corporation – 16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

80C186EC 188EC 80L186EC 188EC
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Storage Temperature
b_{65 C to} a_{150 C}
Case Temperature Under Bias ^b65 C to ^a100 C
Supply Voltage
with Respect to V_SS
Voltage on Other Pins
with Respect to V_SS
b_{0 5V to} a_{6 5V}
b_{0 5V to VCC} a _{0 5V}
NOTICE This data sheet contains preliminary infor-
mation on new products in production The specifica-
tions are subject to change without notice Verify with
your local Intel Sales office that you have the latest
data sheet before finalizing a design
WARNING Stressing the device beyond the ‘‘Absolute
Maximum Ratings’’ may cause permanent damage
These are stress ratings only Operation beyond the
‘‘Operating Conditions’’ is not recommended and ex-
tended exposure beyond the ‘‘Operating Conditions’’
may affect device reliability
Recommended Connections
Power and ground connections must be made to
multiple V_CC and V_SS pins Every 80C186EC-based
circuit board should include separate power (V_CC)
and ground (V_SS) planes Every V_CC pin must be
connected to the power plane and every V_SS pin
must be connected to the ground plane Liberal de-
coupling capacitance should be placed near the
processor The processor can cause transient pow-
er surges when its output buffers transition particu-
larly when connected to large capacitive loads
Low inductance capacitors and interconnects are
recommended for best high frequency electrical per-
formance Inductance is reduced by placing the de-
coupling capacitors as close as possible to the proc-
essor V_CC and V_SS package pins
Always connect any unused input to an appropriate
signal level In particular unused interrupt inputs
(NMI INT0 7) should be connected to V_SS through a
pull-down resistor Leave any unused output pin un-
connected
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