TLE9261-3QX Datasheet, PDF (182/186 Pages) Infineon Technologies AG – Dedicated Data Sheets are available for the different product variants

TLE9261-3QX
16.3
Thermal Behavior of Package
Application Information
Below figure shows the thermal resistance (R_{th_JA}) of the device vs. the cooling area on the bottom of the PCB for
Ta = 85°C. Every line reflects a different PCB and thermal via design.
Figure 61 Thermal Resistance (R_{th_JA}) vs. Cooling Area
Data Sheet
182
Rev. 1.1, 2014-09-26