TLE9261-3QX Datasheet, PDF (11/186 Pages) Infineon Technologies AG – Dedicated Data Sheets are available for the different product variants

TLE9261-3QX
Pin Configuration
Pin Symbol
Function
31
INT
Interrupt Output; used as wake-up flag for microcontroller in SBC Stop or Normal
Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config 1/3,
no external pull-up sets config 2/4.
32
RO
Reset Output
33
N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
34
N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
35
TXDCAN
Transmit CAN; alternate function: calibration of high-precision oscillator
36
RXDCAN
Receive CAN
37
VCAN
Supply Input; for internal HS-CAN cell
38
GND
GND
39
CANL
CAN Low Bus Pin
40
CANH
CAN High Bus Pin
41
n.c.
not connected; internally not bonded.
42
N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
43
GND
Ground
44
N.U.
Not Used; Used for internal testing purpose. Do not connect, leave open
45
n.c.
not connected; internally not bonded.
46
n.c.
not connected; internally not bonded.
47
FO2
Fail Output 2 - Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also Chapter 13.1.1)
48
FO3/TEST
Fail Output 3 - Pulsed Light Output; Break/rear light 100Hz 20% duty cycle output;
Open drain. Active LOW
TEST; Connect to GND to activate SBC Software Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also Chapter 13.1.1)
Cooling GND
Tab
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.¹⁾
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB. The
exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
Note: all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
Data Sheet
11
Rev. 1.1, 2014-09-26