BTS54040-LBF_15 Datasheet, PDF (16/67 Pages) Infineon Technologies AG – SPI Power Controller

BTS54040-LBF
4.2
Thermal Resistance
Electrical Characteristics
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 3 Thermal Resistance
Parameter
Symbol
Values
Unit Note / Test Condition Number
Min. Typ. Max.
Junction to Soldering Point
R_thJSP
–
2
–
K/W ¹⁾
P_4.2.1
T_j(0) = 105 °C
measured to pin 25
Junction to Ambient
R_thJA
–
21
–
1) Not subject to production test, specified by design.
K/W
1)2)
T_j(0) = 105 °C
P_4.2.2
2) Specified R_thJA values is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product (chip
and package) was simulated on a 76.4 * 114.3 * 1.5 mm board with 2 inner copper layers (2 * 70 µm Cu, 2 * 35 µm Cu).
Where applicable, a thermal via array under the package contacted the first inner copper layer.
4.2.1 PCB Setup
1.5mm
Figure 4 2s2p PCB Cross Section
0.3mm
70µm
35µm
Zth_PCB_2s2p.emf
Data Sheet
16
Rev. 2.1, 2014-12-05