XC2288H_11 Datasheet, PDF (147/151 Pages) Infineon Technologies AG – 16/32-Bit Single-Chip Microcontroller with 32-Bit Performance

XC2288H, XC2289H
XC2000 Family / High Line
Package and Reliability
5
Package and Reliability
The XC2000 Family devices use the package type PG-LQFP (Plastic Green - Low
Profile Quad Flat Package). The following specifications must be regarded to ensure
proper integration of the XC228xH in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 44 Package Parameters (PG-LQFP-144-13)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension Ex × Ey –
8.0 × 8.0 mm –
Power Dissipation
Thermal resistance
Junction-Ambient
P_DISS
–
R_ΘJA
–
<1
W–
39
K/W 2-layer, no vias¹⁾
33
K/W 4-layer,
unsoldered²⁾
24
K/W 4-layer, no vias,
soldered³⁾
19
K/W 4-layer, vias,
soldered⁴⁾
1) Device mounted on a 2-layer JEDEC board (JESD 51-3) without thermal vias; exposed pad soldered or not
soldered.
2) Device mounted on a 4-layer JEDEC board (JESD 51-7) with or without thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (JESD 51-7) without thermal vias; exposed pad soldered.
4) Device mounted on a 4-layer JEDEC board (JESD 51-7) with thermal vias; exposed pad soldered.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC228xH is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
particular, the size of the Exposed Pad (if present) may vary.
Data Sheet
147
V1.3, 2011-07