STAC9752A Datasheet, PDF (100/106 Pages) Integrated Device Technology – AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK

STAC9752A/9753A
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
PC AUDIO
13.3. PC Board Recommendations for 32-pad QFN Package
Figure 28. Recommended PCB Layout for 32-pad QFN Package
SUGGESTED FOOTPRINT
PAD DETAIL
32
1
4.75 mm
2.375 mm
24
0.30 mm
0.15 mm
0.50 mm typical
8
2.375 mm
16
4.75 mm
0.375 mm
0.75 mm
NOTES:
1. Oblong pad is preferred geometry.
2. Oblong pad may be replaced with Rectangular pad of the same overall
dimensions.
3. Oblong pad may be replaced with Bullet pad of the same overall dimensions. If
a Bullet pad is used, flat shall be to the outside.
4. Solderpaste shall be oblong pad regardless of the pad geometry. Solderpaste
opening shall be the same dimensions as pad detail.
5. Recommended solderpaste stencil thickness is 0.127 mm, electropolished.
6. Soldermask is to be 1 mm larger in X- and Y-dimensions.
IDT™
100
AC’97 2.3 CODECS WITH STEREO MICROPHONE & UNIVERSAL JACK
STAC9752A/9753A
V 1.5 1206