HDMP-2689 Datasheet, PDF (19/28 Pages) Agilent(Hewlett-Packard) – Quad 2.125/1.0625 GBd Fibre Channel General Purpose SerDes

A1 BALL PAD CORNER
A1 BALL PAD
INDICATOR, 1.0
7. _{DIA. OPTIONAL}
AREA AVAILABLE MARKING
4 x 45° CHAMFER
19.00
17.70
+0.35
–0.05
7.30
3.55
14.80 MAX
TOP VIEW
0.20 (4X)
A
B
3.55
14.80
MAX.
17.70+–00..0355
7.30
19.00
30° TYP
0.35 C
0.25 C
0.15 C
C
5. φ0.50±0.10
φ0.30 M C A B
φ0.10 M C
6. SEATING PLANE
0.80 ± 0.05
0.40 ± 0.10
DIM "A"
DIM "B"
SIDE VIEW
1.00
1.50 REF
A1 BALL PAD CORNER
16 14 12 10 8 6 4 2
17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
1.50 REF
1.00
0.50 R, 3 PLACES
BOTTOM VIEW
289 Solder Balls
Pin 1 Corner
Agilent
HDMP-2689
LLLLLLLLL-NN
G YYWW B2.3
AAAAAAAAAAA
Figure 21. Package Layout and Marking Top View.
4
1.76±0.21 0.56±0.06 STANDARD
NO. LAYERS DIM "A" DIM "B"
NOTES
PBGA THICKNESS SCHEDULE
NOTES: UNLESS OTHERWISE SPECIFIED
1. All dimensions and tolerances conform to ASME Y14.5M-1994.
2. The basic solder ball grid pitch is 1.00 mm.
3. Solder ball matrix size is 17 x 17.
4. Number of solder balls is 289.
5. Dimension is measured at the maximum solder ball diameter.
Parallel to primary datum C.
6. Primary datum C and seating plane are defined by
the spherical crowns of the solder balls.
7. A1 ball pad corner I.D. for plate mold: marked by laser.
Auto mold: dimple formed by mold cap.
8. This drawing conforms to the JEDEC registered outline MS-034/A.
Marking Diagram:
Text Code
LLLLLLLLL NN
B2.3
G YYWW
AAAAAAAAAAA
Description
LLLLLLLLL=Wafer Lot Number NN=Wafer Number
Die Revision
G=Supplier Code
Date Code (YY=YEAR, WW=WEEK)
Country of Assembly
19