HDMP-2689 Datasheet, PDF (18/28 Pages) Agilent(Hewlett-Packard) – Quad 2.125/1.0625 GBd Fibre Channel General Purpose SerDes

70841B
83480A
PATTERN
GENERATOR*
106.25 MHz ^OSCILLOSCOPE
TRIGGER
0011111100 static K28.7
Trigger Out
CH1 CH2
Clock In
TXnP TXnN
2.125 GHz
DIVIDE
BY 20
HDMP-2689
70311A
CLOCK
0.1 µF
RFCP
SOURCE
100 Ω
*PATTERN GENERATOR _Balun
PROVIDES PATTERN-
SYNCHRONOUS TRIGGER
0.1 µF
RFCN _TDn[9:0]
Static K28.7 from pattern generator
or user pattern controlled by MDIO
a) BLOCK DIAGRAM OF RJ MEASUREMENT METHOD
70311A
CLOCK
SOURCE
DIVIDE
BY 20
2.125 GHz
83480A
OSCILLOSCOPE
TRIGGER
CH1 CH2
106.25 MHz
0.1 µF
100 Ω
Balun _{0.1 µF}
TXnP TXnN
HDMP-2689
RFCP
RFCN
RXnP
RXnN
TDn[9:0] RDn[9:0]
70841B
PATTERN
GENERATOR*
+K28.5, -K28.5
or CRPAT
+Data
-Data
b) BLOCK DIAGRAM OF DJ MEASUREMENT METHOD
Figure 20. Transmitter DJ and RJ Measurement Method.
Table 19 . Pin Input Capacitance.
Symbol
CINPUT
Parameters
Input Capacitance on SSTL Input pins
Units
pF
Min Typ
Max
1.1
Package Information
Package Thermal Characteristics
Symbol
Parameter
Units
Typ
Max
P_Dmax
θ_JA[1]
Power Dissipation
Thermal Resistance: Junction to Ambient
Air Flow (LFPM)
0
200
400
600
W
2.5
°C/W
27.8
°C/W
24.3
°C/W
23.1
°C/W
22.1
Ψ_JT[2]
Thermal Characterization parameter: Junction to package top
°C/W
4.8
Ψ_JB[3]
Thermal Characterization parameter: Junction to board
°C/W
19.3
Notes:
Based on independent package testing done by Agilent,
1. θ_JA is based on thermal measurement in still air environment at 25°C on a standard 4 x 4” FR4 PCB as specified in EIA/JESD 51-9.
2. Ψ_JT is used to determine the actual junction temperature in a given application, using the following equation:
T_J = Ψ_JT x P_D + T_T where T_T is the measured temperature on top center of the package (also known as Case temperature, Tc) and P_D is the power being
dissipated.
3. Ψ_JB is used to determine the actual junction temperature in a given application, using the following equation:
T_J = Ψ_JB x P_D + T_B where T_B is measured board temperature, along the side of package at center on board surface and P_D is the power being dissipated.
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