MB82DBS02163C Datasheet, PDF(61/63 Page) Fujitsu Component Limited. – 32 M Bit (2 M word×16 bit) Mobile Phone Application Specific Memory

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MB82DBS02163C Datasheet, PDF (61/63 Pages) Fujitsu Component Limited. – 32 M Bit (2 M word×16 bit) Mobile Phone Application Specific Memory

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MB82DBS02163C-70L

â BONDING PAD INFORMATION

Please contact local FUJITSU representative for pad layout and pad coordinate information.

â ORDERING INFORMATION

Part Number

MB82DBS02163C-70LWT

MB82DBS02163C-70LPBT

Shipping Form / Package

wafer

71-ball plastic FBGA

(BGA-71P-M03)

Remarks

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