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MC9S08SG8 Datasheet, PDF (290/310 Pages) Freescale Semiconductor, Inc – Microcontrollers
Appendix A Electrical Characteristics
A.12 AC Characteristics
This section describes timing characteristics for each peripheral system.
A.12.1 Control Timing
Table A-12. Control Timing
Num C
Rating
Symbol
Min
Typ1
Max Unit
1
P Bus frequency (tcyc = 1/fBus)
fBus
dc
—
20
MHz
2 P Internal low power oscillator period
tLPO
700
1300 µs
3
P External reset pulse width2
textrst
1.5 x tcyc
—
ns
4
P Reset low drive3
trstdrv
34 x tcyc
—
ns
5
P
BKGD/MS setup time after issuing background debug
force reset to enter user or BDM modes
tMSSU
25
—
ns
6
P
BKGD/MS hold time after issuing background debug
force reset to enter user or BDM modes 4
tMSH
25
—
µs
8
Pin interrupt pulse width
P Asynchronous path2
Synchronous path5
Port rise and fall time —
Low output drive (PTxDS = 0) (load = 50 pF)5
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
9
D
Port rise and fall time —
High output drive (PTxDS = 1) (load = 50 pF)
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
tILIH, tIHIL
100
—
1.5 x tcyc
tRise, tFall
—
40
—
75
tRise, tFall
—
11
—
35
—
ns
—
ns
—
—
ns
—
1 Typical values are based on characterization data at VDD = 5.0V, 25°C unless otherwise stated.
2 This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to
override reset requests from internal sources.
3 When any reset is initiated, internal circuitry drives the reset pin low for about 34 cycles of tcyc.
4 To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of tMSH after VDD
rises above VLVD.
5 Timing is shown with respect to 20% VDD and 80% VDD levels. Temperature range –40°C to 125°C.
RESET PIN
textrst
Figure A-10. Reset Timing
MC9S08SG8 MCU Series Data Sheet, Rev. 0
290
PRELIMINARY
Freescale Semiconductor