MC9S08QE16CLC Datasheet, PDF (17/350 Pages) Freescale Semiconductor, Inc – Low-power wireless applications, Gas, water and heater meters

Section Number
Title
Page
15.6.1 Counter ............................................................................................................................271
15.6.2 Channel Mode Selection .................................................................................................274
15.7 Reset Overview .............................................................................................................................277
15.7.1 General ............................................................................................................................277
15.7.2 Description of Reset Operation .......................................................................................277
15.8 Interrupts .......................................................................................................................................277
15.8.1 General ............................................................................................................................277
15.8.2 Description of Interrupt Operation .................................................................................278
15.9 The Differences from TPM v2 to TPM v3 ....................................................................................279
Chapter 16
Development Support
16.1 Introduction ...................................................................................................................................283
16.1.1 Features ...........................................................................................................................284
16.2 Background Debug Controller (BDC) ..........................................................................................284
16.2.1 BKGD Pin Description ...................................................................................................285
16.2.2 Communication Details ..................................................................................................286
16.2.3 BDC Commands .............................................................................................................290
16.2.4 BDC Hardware Breakpoint .............................................................................................292
16.3 On-Chip Debug System (DBG) ....................................................................................................293
16.3.1 Comparators A and B .....................................................................................................293
16.3.2 Bus Capture Information and FIFO Operation ...............................................................293
16.3.3 Change-of-Flow Information ..........................................................................................294
16.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................294
16.3.5 Trigger Modes .................................................................................................................295
16.3.6 Hardware Breakpoints ....................................................................................................297
16.4 Register Definition ........................................................................................................................297
16.4.1 BDC Registers and Control Bits .....................................................................................297
16.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................299
16.4.3 DBG Registers and Control Bits .....................................................................................300
Appendix A
Electrical Characteristics and Timing Specifications
A.1 Introduction ....................................................................................................................................305
A.2 Parameter Classification.................................................................................................................305
A.3 Absolute Maximum Ratings...........................................................................................................306
A.4 Thermal Characteristics..................................................................................................................307
A.5 ESD Protection and Latch-Up Immunity .......................................................................................308
A.6 DC Characteristics..........................................................................................................................310
A.7 Supply Current Characteristics.......................................................................................................314
A.8 ADC Characteristics.......................................................................................................................317
A.9 Internal Clock Generation Module Characteristics ........................................................................320
MC9S08AC60 Series Data Sheet, Rev. 3
Freescale Semiconductor
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