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MC9328MX1 Datasheet, PDF (14/96 Pages) Freescale Semiconductor, Inc – i.MX Integrated Portable System Processor
Specifications
3 Specifications
This section contains the electrical specifications and timing diagrams for the MC9328MX1 processor.
3.1 Maximum Ratings
Table 4 provides information on maximum ratings which are those values beyond which damage to the device may
occur. Functional operation should be restricted to the limits listed in Recommended Operating Range Table 5 on
page 15 or the DC Characteristics table.
Table 4. Maximum Ratings1
Symbol
Rating
Minimum
Maximum
Unit
NVdd
DC I/O Supply Voltage
–
–
V
QVdd
DC Internal (core) Supply Voltage
–
–
V
AVdd
DC Analog Supply Voltage
–
–
V
BTRFVdd
DC Bluetooth Supply Voltage
–
–
V
Vdd
Supply voltage
-0.3
3.3
V
TA
Maximum operating temperature range
MC9328MX1VH20/MC9328MX1VM20
0
70
°C
TA
Maximum operating temperature range
MC9328MX1DVH20/MC9328MX1DVM20
-30
70
°C
TA
Maximum operating temperature range
MC9328MX1CVH15/MC9328MX1CVM15
-40
85
°C
VESD_HBM ESD at human body model (HBM)
–
2000
V
VESD_MM ESD at machine model (MM)
–
100
V
ILatchup
Latch-up current
–
200
mA
Test
Storage temperature
-55
150
°C
Pmax
Power Consumption
8002
13003
mW
1. Voltages referenced to Vss and BTRFGND, which are both tied to the same potential.
2. A typical application with 30 pads simultaneously switching assumes the GPIO toggling and instruction fetches from
the ARM core-that is, 7x GPIO, 15x Data bus, and 8x Address bus.
3. A worst-case application with 70 pads simultaneously switching assumes the GPIO toggling and instruction fetches
from the ARM core-that is, 32x GPIO, 30x Data bus, 8x Address bus. These calculations are based on the core
running its heaviest OS application at 200MHz, and where the whole image is running out of SDRAM. QVDD at
2.0V, NVDD and AVDD at 3.3V, therefore, 180mA is the worst measurement recorded in the factory environment,
max 5mA is consumed for OSC pads, with each toggle GPIO consuming 4mA.
MC9328MX1 Advance Information, Rev. 4
14
Freescale Semiconductor