S9S12G48F1CLC Datasheet, PDF (1289/1292 Pages) Freescale Semiconductor, Inc – Microcontrollers

Die Pad
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
Table D-1. Bondpad Coordinates
Bond Post
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
77
78
79
80
81
82
83
84
85
86
Die Pad
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
1707.5
1598.5
1477.5
1237.5
1117.5
947.5
777.5
652.5
527.5
422.5
327.5
242.5
Die Pad
Y Coordinate
-467.5
-360.5
-253.5
-148.5
-41.5
65.5
172.5
279.5
386.5
493.5
598.5
705.5
812.5
919.5
1026.5
1133.5
1240.5
1347.5
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
-1472.06
Package and Die Information
Function
PAD[9]
PAD[2]
PAD[10]
PAD[3]
PAD[11]
PAD[4]
PAD[12]
PAD[5]
PAD[13]
PAD[6]
PAD[14]
PAD[7]
PAD[15]
PC[4]
PC[5]
PC[6]
PC[7]
VRH
VDDA
VRL
VSSA
PD[0]
PD[1]
PD[2]
PD[3]
PS[0]
PS[1]
PS[2]
PS[3]
PS[4]
Freescale Semiconductor
MC9S12G Family Reference Manual, Rev.1.23
1291