S9S12GN32F0MLC Datasheet, PDF (1287/1292 Pages) Freescale Semiconductor, Inc – MC9S12G Family Reference Manual and Data Sheet

D.7 KGD Information
Bondpad Coordinates
Die Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Table D-1. Bondpad Coordinates
Bond Post
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Die Pad
X Coordinate
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1832.06
-1707.5
-1506.5
Die Pad
Y Coordinate
1347.5
1223.5
1116.5
1009.5
902.5
795.5
688.5
603.5
496.5
369
241.5
136.5
22.5
-91.5
-201.5
-311.5
-396.5
-483.5
-578.5
-683.5
-797.5
-921.5
-1054.5
-1196.5
-1347.5
-1472.06
-1472.06
Package and Die Information
Function
PJ[6]
PJ[5]
PJ[4]
PA[0]
PA[1]
PA[2]
PA[3]
RESET
VDDX1
VDDR
VSSX1
PE[0]
VSS1
PE[1]
TEST
PA[4]
PA[5]
PA[6]
PA[7]
PJ[0]
PJ[1]
PJ[2]
PJ[3]
BKGD
PB[0]
PB[1]
PB[2]
Freescale Semiconductor
MC9S12G Family Reference Manual, Rev.1.23
1289