IBIS4-6600_09 Datasheet, PDF (33/35 Pages) Cypress Semiconductor – 6.6 MP CMOS Image Sensor

IBIS4-6600 CYII4SM6600AB
Figure 31. Reflow Soldering Temperature Profile
RoHS (Pb-Free) Compliance
This section reports the use of Hazardous chemical substances as required by the RoHS Directive (excluding packing material).
Table 17. The Chemical Substances and Information about Any Intentional Content
Chemical Substance
Lead
Cadmium
Mercury
Hexavalent chromium
PBB (Polybrominated biphenyls)
PBDE (Polybrominated diphenyl ethers)
Intentional Content
NO
NO
NO
NO
NO
NO
Portion Containing Intentional Content
-
-
-
-
-
-
Pb-Free Soldering
IBIS4-A-6600-M2 (serial numbers beyond 3694): This product is
successfully tested for Pb-free soldering processes, using a
reflow temperature profile with maximum 260°C, minimum 40s
at 255°C, and minimum 90s at 217°C.
IBIS4-A-6600-C2: This product does not withstand a lead-free
soldering process. Maximum allowed reflow or wave soldering
temperature is 220°C. Hand soldering is recommended for this
part type.
Note that "Intentional content" is defined as any material
demanding special attention is contained into the inquired
product by following cases:
1. A case that the previously mentioned material is added as a
chemical composition into the inquired product intentionally,
to produce and maintain the required performance and
function of the intended product.
2. A case that the previously mentioned material, which is used
intentionally in the manufacturing process, is contained in or
adhered to the inquired product.
The following case is not treated as "intentional content":
A case that the previously mentioned material is contained as an
impurity into raw materials or parts of the intended product. The
impurity is defined as a substance that cannot be removed
industrially, or is produced at a process, such as chemical
composing or reaction and cannot be removed technically.
Document Number: 001-02366 Rev. *E
Page 33 of 35
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