W948D6FBHX5E-TR Datasheet, PDF (56/60 Pages) Winbond – 256Mb Mobile LPDDR

W948D6FB / W948D2FB
9. PACKAGE DIMENSIONS
9.1: LPDDR X 16
256Mb Mobile LPDDR
VFBGA60Ball (8X9 MM^2, Ball pitch:0.8mm)
Note:
1. Ball land:0.5mm. Ball opening:0.4mm. PCB Ball land suggested ≦0.4mm
2. Dimensions apply to Solder Balls Post-Reflow. The Pre-Reflow diameter is 0.42 on a 0.4 SMD Ball Pad.
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Publication Release Date : Oct, 15, 2012
Revision : A01-004