TX4939 Datasheet, PDF (43/756 Pages) Toshiba Semiconductor – 64-Bit TX System RISC

Handling Precautions
(7) Ensure, to the extent possible, that any articles (such as clipboards) which are brought to a static electricity
control area are constructed of anti-static materials.
(8) When the human body is to come in direct contact with a device, wear anti-static finger covers or gloves.
(9) The material of equipment safety covers located near devices should have a resistance rating of 1 x 10⁹Ω or
less.
(10) If a wrist strap cannot be used and there is a possibility of imparting friction to devices, use an ionizer.
(11) The transport film used in tape carrier products is manufactured from materials in which static electricity
readily builds up. When using these products, use an ionizer to prevent the film from being charged. Also,
to ensure than no static electricity will be applied to the copper foil area, take measures to prevent
electrostatic discharge failure of peripheral equipment.
3.1.2 Vibration, Impact and Stress
Handle devices and packaging with care. Dropping or applying impact to
devices or packaging causes device damage. Ensure that devices and packaging
are not subjected to mechanical vibration or impact to the extent possible.
Hollow canister-type devices and ceramic sealed devices contain unsecured
Vibration
wires, making them more susceptible to vibration and impact than plastic
sealed devices.
When a location such as a soldered area, connecting area or top surface of a device is subjected to vibration,
impact or stress in actual equipment, bonding fault or device destruction may result. Therefore, be sure to keep
this in mind at the time of structural design. If a device is subject to especially strong vibration, impact or stress,
the package or chip may crack. If stress is applied to a semiconductor chip through the package, changes in the
resistance of the chip may result due to piezoelectric effects, resulting in fluctuation in element characteristics.
Furthermore, if a stress that does not instantly result in damage is applied continually for a long period of time,
product deformation may result, causing defects such as disconnection or element failure. Thus, at the time of
structural design, carefully consider vibration, impact and stress.
3.2 Storage
3.2.1 General Packaged Products
(1) Avoid storage locations where devices may be exposed to
moisture or direct sunlight.
(2) Follow the precautions printed on the packing label of the
device for transportation and storage.
(3) Keep the storage location temperature and humidity within a
range of 5°C to 35°C and 45% to 75%, respectively.
Humidity:
Temperature:
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