DS125BR820 Datasheet, PDF (7/62 Pages) Texas Instruments – Low-Power 12.5 Gbps 8-Channel Linear Repeater

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DS125BR820
SNLS491B – JULY 2014 – REVISED FEBRUARY 2015
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (VDD to GND, 2.5 V Mode)
Supply Voltage (VIN to GND, 3.3 V Mode)
LVCMOS Input/Output Voltage
CML Input Voltage
CML Input Current
Storage temperature, T_stg
Lead Temperature Range Soldering (4 sec.)⁽²⁾, T_solder
MIN
MAX
UNIT
-0.5
+2.75
V
-0.5
+4.0
V
-0.5
+4.0
V
-0.5
VDD + 0.5
V
-30
+30
mA
-40
125
°C
260
°C
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other
conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions
indicate conditions at which the device is functional and the device should not be operated beyond such conditions. Absolute Maximum
Numbers are ensured for a junction temperature range of -40°C to +125°C. Models are validated to Maximum Operating Voltages only.
(2) For soldering specifications, see application note SNOA549.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±1000
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±4000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Supply Voltage (2.5 V mode)⁽¹⁾
Supply Voltage (3.3 V mode)⁽¹⁾
Ambient Temperature
SMBus (SDA, SCL)
Supply Noise up to 50 MHz⁽²⁾
(1) DC plus AC power should not exceed these limits.
(2) Allowed supply noise (mVp-p sine wave) under typical conditions.
MIN
2.375
3.0
-40
NOM
2.5
3.3
100
MAX
2.625
3.6
+85
3.6
UNIT
V
V
°C
V
mVp-p
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
NJY
54 PINS
UNIT
R_θJA
R_θJCtop
R_θJB
ψ_JT
ψ_JB
R_θJCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
26.6
10.8
4.4
°C/W
0.2
4.3
1.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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