AM1707_14 Datasheet, PDF (6/201 Pages) Texas Instruments – Microprocessor

AM1707
SPRS637E – FEBRUARY 2010 – REVISED JUNE 2014
www.ti.com
Revision History (continued)
SEE
Section 6.11.4
EMIFB Electrical
Data/Timing
Section 6.16
Multichannel Audio
Serial Ports
(McASP0, McASP1,
and McASP2)
Section 6.32
Real Time Clock
(RTC)
Section 7.6
Glossary
ADDITIONS/MODIFICATIONS/DELETIONS
Table 6-26, EMIFB SDRAM Interface Timing Requirements:
• Updated/Changed Parameter No. 19 from "t_su(DV-CLKH)" to "t_(DV-CLKH)"
• Added new column: "CVDD = 1.3V"
• Added new footnote containing "...range rated devices for 456 MHz max CPU operating..."
• Added new footnote containing "...range rated devices for 400/375/300/266/200 MHz max CPU
operating ..."
Table 6-27, EMIFB SDRAM Interface Switching Characteristics for Commercial (Default) Temperature
Range:
• Updated/Changed table title from "...Switching Characteristics..." to "...Switching Characteristics for
Commercial (Default) Temperature Range"
• Added new footnote containing "...range rated devices for 456 MHz max CPU operating ..."
• Added new footnote containing "...range rated devices for 400/375/300/266/200 MHz max CPU
operating..."
• Updated/Changed CVDD = 1.3V MIN column values for Parameter No. 4, 6, 8, 10, 12, 14, 16, and 18
from "0.9" to "1.1"
• Updated/Changed CVDD = 1.3V MAX column values for Parameter No. 3, 5, 7, 9, 11, 13, 15, and 17
from "5.1" to "4.25"
• Populated CVDD = 1.2V column with values (was empty)
• Updated/Changed Parameter No. 18 from "t_{ena(CLKH-DLZ)}" to "t_(CLKH-DLZ)"
Table 6-28, EMIFB SDRAM Interface Switching Characteristics for Industrial, Extended, and Automotive
Temperature Ranges:
• Added NEW table
Table 6-45, McASP Registers Accessed Through DMA Port:
• Updated/Changed Read Accesses Register Description from "XBUSEL = 0 in XFMT" to "RBUSEL = 0 in
RFMT"
• Updated/Changed Write Accesses Register Description from "RBUSEL = 0 in RFMT" to "XBUSEL = 0 in
XFMT"
Section 6.32.2, Registers:
• Deleted "See the device-specific data ..." sentence
Added NEW section.
3 Device Overview
3.1 Device Characteristics
Table 3-1 provides an overview of the device. The table shows significant features of the device, including
the capacity of on-chip RAM, peripherals, and the package type with pin count.
6
Device Overview
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