AM1707_14 Datasheet, PDF (197/201 Pages) Texas Instruments – Microprocessor

PACKAGE OPTION ADDENDUM
www.ti.com
24-Mar-2014
PACKAGING INFORMATION
Orderable Device
AM1707BZKB3
AM1707BZKB4
AM1707BZKBA3
AM1707BZKBD4
AM1707BZKBT3
AM1707DZKB3
AM1707DZKB4
AM1707DZKBA3
AM1707DZKBD4
AM1707DZKBT3
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
NRND
BGA
ZKB 256
TBD
NRND
BGA
ZKB 256
TBD
NRND
BGA
ZKB 256
TBD
NRND
BGA
ZKB 256
TBD
NRND
BGA
ZKB 256
TBD
ACTIVE
BGA
ZKB 256 90 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
ZKB 256 90 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
ZKB 256 90 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
ZKB 256 90 Green (RoHS
& no Sb/Br)
ACTIVE
BGA
ZKB 256 90
TBD
Lead/Ball Finish
(6)
Call TI
Call TI
Call TI
Call TI
Call TI
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Call TI
MSL Peak Temp Op Temp (°C)
(3)
Call TI
0 to 90
Call TI
0 to 90
Call TI
-40 to 105
Call TI
-40 to 90
Call TI
-40 to 125
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Call TI
Device Marking
(4/5)
AM1707BZKB3
AM1707BZKB4
AM1707BZKBA3
AM1707BZKBD4
AM1707BZKBT3
AM1707DZKB3
AM1707DZKB4
AM1707DZKBA3
AM1707DZKBD4
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
Addendum-Page 1
Samples