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MSP430FR5994_17 Datasheet, PDF (27/168 Pages) Texas Instruments – Mixed-Signal Microcontrollers
www.ti.com
MSP430FR5994, MSP430FR59941, MSP430FR5992, MSP430FR5964, MSP430FR5962
SLASE54A – MARCH 2016 – REVISED OCTOBER 2016
5 Specifications
NOTE
Current consumption values are estimations only, not final values.
5.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Voltage applied at DVCC and AVCC pins to VSS
Voltage difference between DVCC and AVCC pins(2)
–0.3
4.1
V
±0.3
V
Voltage applied to any pin (3)
–0.3
VCC + 0.3 V
(4.1 V Max)
V
Diode current at any device pin
Storage temperature, Tstg(4)
±2
mA
–40
125
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage differences between DVCC and AVCC exceeding the specified limits may cause malfunction of the device including erroneous
writes to RAM and FRAM.
(3) All voltages referenced to VSS.
(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
5.2 ESD Ratings
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
VALUE
±1000
±250
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as
±1000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V
may actually have higher performance.
Copyright © 2016, Texas Instruments Incorporated
Specifications
27
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