English
Language : 

5962-1123701VXC Datasheet, PDF (18/25 Pages) Texas Instruments – 16-Mb RADIATION-HARDENED SRAM
SMV512K32-SP
SLVSA21H – JUNE 2011 – REVISED JULY 2013
SYMBOL
Table 11. AC Characteristics for EDAC Function (1)
PARAMETER
MIN
MAX
tBLSL
tBLBL
tSLSH
User programmable, BUSYZ low to SCRUBZ low
User programmable, BUSYZ low to BUSYZ low
SCRUBZ low to SCRUBZ high
See Table 10
See Table 9
200
504
tSHBH
SCRUBZ high to BUSYZ high
50
120
UNIT
ns
ns
ns
ns
tETMH
Device enable to MBE high
5.5
ns
tGHMH
GZ high to MBE high
6.5
ns
tAVMH
Address valid to MBE high
0.9
ns
tMHML
MBE high to MBE low
12.8
ns
tMLEF
MBE low to device disable
0.4
ns
tMLGL
MBE low to GZ low
1.8
ns
tMLAX
MBE low to address change
0.1
tMHQX
MBE high to data change
4.5
tMHQV
MBE high to data valid
tEFQZ
Memory enable change to output data tri-state
3.5
tEFMZ (2)
Memory enable change to MBE tri-state
3.5
tGLMX
GZ-controlled error flag enable time
3.5
tETMX
E-controlled error flag enable time
3.5
tINIT_E
E1Z low to BUSYZ low
tINIT_MBE
MBE low to BUSYZ low
tSLMV
SCRUBZ low to MBE valid
tE1ZHSH
tE1ZHBH
tMHBH
E1Z high to SCRUBZ high
E1Z high to BUSYZ high
MBE high to BUSYZ high
(1) TC = -55°C to 125°C, VDD1 = 1.7 V to 1.9 V, VDD2 = 3 V to 3.6 V (unless otherwise noted).
(2) Parameters ensured by design and/or characterization if not production tested.
ns
ns
8.2
ns
5
ns
5
ns
ns
ns
160
ns
160
ns
146
ns
20
ns
20
ns
20
ns
www.ti.com
FIGURE
Figure 13
Figure 14
Figure 14
Figure 13
Figure 14
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 15
Figure 16
Figure 17
Figure 15
Figure 16
Figure 17
Figure 15
Figure 16
Figure 17
Figure 15
Figure 16
Figure 17
Figure 15
Figure 16
Figure 17
Figure 15
Figure 16
Figure 17
Figure 16
Figure 17
Figure 16
Figure 17
Figure 16
Figure 17
Figure 14
Figure 13
Figure 14
Figure 14
Figure 13
Figure 13
Figure 14
Figure 14
Figure 14
Figure 15
18
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: SMV512K32-SP