5962-1123701VXC Datasheet, PDF (1/25 Pages) Texas Instruments – 16-Mb RADIATION-HARDENED SRAM

SMV512K32-SP
www.ti.com
SLVSA21H – JUNE 2011 – REVISED JULY 2013
16-Mb RADIATION-HARDENED SRAM
Check for Samples: SMV512K32-SP
FEATURES
1
• 20-ns Read, 13.8-ns Write Through Maximum
Access Time
• Functionally Compatible With Commercial
512K x 32 SRAM Devices
• Built-In EDAC (Error Detection and Correction)
to Mitigate Soft Errors
• Built-In Scrub Engine for Autonomous
Correction
• CMOS Compatible Input and Output Level,
Three State Bidirectional Data Bus
– 3.3 ±0.3-V I/O, 1.8 ±0.15-V CORE
xxx
xxx
xxx
• Radiation Performance ⁽¹⁾
– Uses Both Substrate Engineering and
Radiation Hardened by Design (HBD) ⁽²⁾
– TID Immunity > 3e5 rad (Si)
– SER < 5e-17 Upsets/Bit-Day
(Core Using EDAC and Scrub) ⁽³⁾
– Latch up immunity > LET = 110 MeV
(T = 398K)
• Available in a 76-Lead Ceramic Quad Flatpack
(1) Radiation tolerance is a typical value based upon initial device
qualification. Radiation Data and Lot Acceptance Testing is
available – contact factory for details.
(2) HardSIL^TM technology and memory design under a license
agreement with Silicon Space Technology (SST).
(3) SER calculated using CREME96 for geosynchronous orbit,
solar minimum.
DESCRIPTION
The SMV512K32 is a high performance asynchronous CMOS SRAM organized as 524,288 words by 32 bits. It is
pin selectable between two modes: master or slave. The master device selection provides user defined
autonomous EDAC scrubbing options. The slave device selection employs a scrub on demand feature that can
be initiated by a master device. Three read cycles and four write cycles (described below) are available
depending on the user needs.
T_C
–55°C to 125°C
25°C
Table 1. ORDERING INFORMATION⁽¹⁾
PACKAGE ⁽²⁾
ORDERABLE PART NUMBER
SMV512K32HFG
76-pin HFG
5962-1123701VXC
SMV512K32HFGMPR
TOP-SIDE MARKING
SMV512K32HFG
5962-1123701VXC
SMV512K32HFG/EM ⁽³⁾
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(3) These units are intended for engineering evaluation only. They are processed to a non compliant flow (e.g., no burn-in) and only tested
at +25°C. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted as to
performance over temperature or operating life.
xxx
HardSIL^TM is a trademark of Silicon Space Technology (SST).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011–2013, Texas Instruments Incorporated