STE2004S Datasheet, PDF (77/79 Pages) STMicroelectronics – 102 x 65 single-chip LCD controller/driver

STE2004S
Figure 76. Alignment marks dimensions
Pad coordinates
85 µm
35 µm
Table 31. Bumps
Bumps size
Pad size
Pad pitch
Spacing between bumps
Table 32. Die mechanical dimensions
Die Size (X x Y)
Wafers thickness
Dimensions
28µmX97µmX17.5µm
35µm X 104µm
45µm
17µm
5.815mm x 1.333mm
500µm
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